About Asetek

Asetek invented the sealed loop liquid cooler and we continue to innovate today. We pride ourselves on providing premium liquid cooling solutions to solve thermal challenges for Gamers, Enthusiasts and Data Center operators. We’re committed to delivering greater performance with quiet cooling – all while continuing to provide the quality and reliability we’re known for.



Our commitment to innovate has brought advances in performance and increased density for data centers — from high performance computing that secures entire countries, to artificial intelligence that is spawning an explosion of new applications for data center users. In addition, our energy saving technology enables data centers to significantly cut energy consumption and even supply district heating networks. We’re innovating to increase density for maximum compute throughput in data centers, and to enable data centers to reduce their carbon footprints.


We are focused on new ways of solving complex thermal challenges, researching new pump designs, new coldplate designs, new fluid types, new radiator technologies and topologies, and much more. We’re innovating with our OEM partners, Gamers and Enthusiasts in mind. We innovate so that users can get the maximum performance from their systems.

Mads Stenstrup

Project manager - Communications

mts@asetek.com

+45 22 14 13 00

Asetek

Assensvej 2

9220 Aalborg

Denmark

www.asetek.com

Asetek offers

Direct to Chip (D2C) liquid cooling technology dramatically increases data center density and enables maximum sustained CPU throughput.
D2C liquid cooling provides a distributed cooling architecture to address the full range of heat rejection scenarios in air-cooled and liquid-cooled data centers.
We offer a highly flexible, reliable and proven liquid cooling platform to efficiently cool the latest server designs and help users manage the transition from an air cooled to liquid cooled environment.
For Data Center Operators, our technology is delivering up to 80kW of cooling capacity per rack to enable deployment of high performance processors in clusters with high interconnect densities.

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